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Technology // Solders

Solders News

Tipping point for lead-free over next decade

Post By: Tom Mulqueen on Wednesday, 10 June 2015

Major US electronics industry association IPC has concluded that the economic inefficiencies in producing electronics for high reliability applications such as military and aerospace will force conversion to lead-free technologies in the near future.

In its report, it notes that the main driver is the increasing scarcity of leaded components, for which an increasing price differential will create 'tipping points' over the next 10 years. The study was based on data from 83 electronic manufacturers and suppliers into these...

Tin-silver plating chemistry for lead-free bump plating

Post By: Andy Pye on Tuesday, 07 January 2014

Dow Electronic Materials has announced tin-silver plating chemistry for use in lead-free solder bump plating applications.

In Cu pillar capping applications, Solderon BP TS 6000, tin-silver forms a smooth, micro-void free interface post reflow. With a single formulation, Solderon BP TS 6000 is capable of plating speeds ranging from 2 to 9um/min, which creates a significantly wider operating window. The tunable nature of the Ag composition in this formulation makes it suitable for a number of applications and eliminates...

Lightning speed laminates: high-frequency materials for lead-free soldering

Post By: Andy Pye on Monday, 06 January 2014

John Coonrod, market development engineer for Rogers Corporation, Advance Circuit Materials Division, has been writing in PC Design about available high frequency thermoplastic and thermoset laminates for PCBs subjected to multiple passes through a lead-free solder reflow cycle.

Qualification requirements differ from one OEM to another, but some will require five, six, or even 10 passes through a lead-free solder reflow process. There are a few different criteria for these tests however, the basic demand is that the PCB...

Counterfeit threats for electronic parts

Post By: Andy Pye on Sunday, 05 January 2014

In an increasingly competitive marketplace surrounded by a global IT supply chain, there is growing concern about the use of counterfeit electronic parts in both commercial and military electronics.

A report from the Senate Armed Services Committee concluded that China is the dominant source of counterfeit electronic parts. The report describes how recycled electronic parts are washed in a river and dried on the riverbank then sorted by women and children for resale as new in Shantou’s electronic counterfeiting...

IBM inventors seek PTH adapter patent

Post By: Andy Pye on Saturday, 04 January 2014

Several IBM inventors have filed a patent application for an adapter for plated through-hole mounting of surface mount components. The disclosure relates to printed circuit board assembly techniques, and more particularly, to the attachment of temperature sensitive components designed for surface mounting.

Many electronic components have a manufacturer-specified thermal processing limit that is not allowed to be exceeded during printed circuit board assembly. Violation of a component's thermal processing limit will degrade the reliability of the component and may...

Technology Trends Study - Participation Opportunity (deadline end January)

Post By: Andy Pye on Friday, 03 January 2014

IPC Market Research is now collecting data for its IPC International Technology Roadmap for Electronic Interconnections, and for its biennial Technology Trends Study. By participating in one survey, you have an opportunity to contribute to both of these important projects.

Participation has its rewards: only survey participants will receive the 2014 Technology Trends Study at no charge and before it becomes available for sale. In addition, the first 100 people to submit a valid and usable survey will...

ITRI International Tin Conference 2014 - early booking rate available until end of January

Post By: Andy Pye on Thursday, 02 January 2014

ITRI’s next International Tin Conference will take place in Penang, Malaysia on 13-16th May 2014 at the Shangri-La Rasa Sayang Hotel and is expected to attract some 300 delegates from around the world.

The key issues facing the tin industry will be addressed formally in the conference sessions and there will also be visits to local tin operations and plenty of opportunities for networking.

Recent addition to the tin conference keynote speakers, Gao Wenxiang, President of Yunnan Tin Company,...

Can printable nanocopper paste eliminate danger of tiny tin whiskers?

Post By: Andy Pye on Wednesday, 01 January 2014

Scientists in the Advanced Materials and Nanosystems directorate at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto have developed a nanotechnology copper-based electrical interconnect material, or solder, that can be processed around 200°C. The CuantumFuse solder material is expected to produce joints with up to 10 times the electrical and thermal conductivity compared to tin-based materials currently in use. Applications are currently under consideration where tin-based, lead-free solder can be prone to tin whiskers; microscopic...

Will nano-sized materials trigger the next big electronics revolution?

Post By: Andy Pye on Thursday, 07 November 2013

Senior electronics executives attending IPC’s recent Management Meetings and Technology Market Research Conference in Chicago were treated to a positive and intriguing look into the future of the materials market.

“Despite its increasing maturity, electronics remains one of the best global chemicals and materials markets” said Phil Plonski, managing director, Prismark Partners. Plonski forecasted an average compounded annual growth rate of 5.6% for the electronics materials market, topping $176 billion by 2017, seeing the largest opportunities for new...

ELV Stakeholder exemption consultation highlights differing views

Post By: Andy Pye on Tuesday, 05 November 2013

The ELV Stakeholder consultation concerning the review of six exemption requests, is closed.

In particular, a collective representation from the automotive industry regarding all six exemptions has been made by the European Automobile Manufacturers Association (ACEA), European Association of Automotive Suppliers (CLEPA), Japan Automobile Manufacturers Association (JAMA) and Korea Automobile Manufacturers Association (KAMA).

The Consultation was announced on 9 September 2013 and concluded on 4 November 2013 and addresses the following entries to be reviewed:

  • 8(e) Lead in high...



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