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Technology // Solders


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Latest News

Tipping point for lead-free over next decade

Post By: Tom Mulqueen on Wednesday, 10 June 2015

Major US electronics industry association IPC has concluded that the economic inefficiencies in producing electronics for high reliability applications such as military and aerospace will force conversion to lead-free technologies in the near future.

In its report, it notes that the main driver is the increasing scarcity of leaded components, for which an increasing price differential will create 'tipping points' over the next 10 years. The study was based on data from 83 electronic manufacturers and suppliers into these...

Essemtec makes solder jetting advances

Post By: Jeremy Pearce on Monday, 31 March 2014

Essemtec, the Swiss manufacturer of equipment for electronics assembly, has launched the world's first SMT assembler with integrated solder jetting.

The new multi-functional SMT center Paraquda won a 2014 NPI Award in the category of Component Placement – Multi-function at the March IPC APEX EXPO 2014.

The jetting is able to use conventional solder pastes rather than the specialised pastes usually required. The solder paste jet can also be retro-fitted to other existing compatible equipment.

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