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Technology // Solders


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Latest News

Essemtec makes solder jetting advances

Post By: Jeremy Pearce on Monday, 31 March 2014

Essemtec, the Swiss manufacturer of equipment for electronics assembly, has launched the world's first SMT assembler with integrated solder jetting.

The new multi-functional SMT center Paraquda won a 2014 NPI Award in the category of Component Placement – Multi-function at the March IPC APEX EXPO 2014.

The jetting is able to use conventional solder pastes rather than the specialised pastes usually required. The solder paste jet can also be retro-fitted to other existing compatible equipment.

Tin-silver plating chemistry for lead-free bump plating

Post By: Andy Pye on Tuesday, 07 January 2014

Dow Electronic Materials has announced tin-silver plating chemistry for use in lead-free solder bump plating applications.

In Cu pillar capping applications, Solderon BP TS 6000, tin-silver forms a smooth, micro-void free interface post reflow. With a single formulation, Solderon BP TS 6000 is capable of plating speeds ranging from 2 to 9um/min, which creates a significantly wider operating window. The tunable nature of the Ag composition in this formulation makes it suitable for a number of applications and eliminates...

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