View in english View in spanish View in french View in german View in chinese

Technology // Solders

Solders

Join the Solders Network Network
a unique global solder community

  • Engagement

    Join with major solder producers, users and researchers

  • Key Issues

    Focus on priority topics directly affecting your business

  • Solder Knowledge

    Access to unique collective solder knowledge resources

  • Expert Assistance

    Access to global experts

Members

Solder producers and users
solder balls smallMembers represent some of the worlds major solder producers and users, working on development and implementation of next generation solder technologies.

Solder researchers in universities and research organisations
scientist affiliate smallAffiliate members are a unique community of researchers in universities and research organisations, exploring the science of solder technology.

Latest News

Essemtec makes solder jetting advances

Post By: Jeremy Pearce on Monday, 31 March 2014

Essemtec, the Swiss manufacturer of equipment for electronics assembly, has launched the world's first SMT assembler with integrated solder jetting.

The new multi-functional SMT center Paraquda won a 2014 NPI Award in the category of Component Placement – Multi-function at the March IPC APEX EXPO 2014.

The jetting is able to use conventional solder pastes rather than the specialised pastes usually required. The solder paste jet can also be retro-fitted to other existing compatible equipment.

Tin-silver plating chemistry for lead-free bump plating

Post By: Andy Pye on Tuesday, 07 January 2014

Dow Electronic Materials has announced tin-silver plating chemistry for use in lead-free solder bump plating applications.

In Cu pillar capping applications, Solderon BP TS 6000, tin-silver forms a smooth, micro-void free interface post reflow. With a single formulation, Solderon BP TS 6000 is capable of plating speeds ranging from 2 to 9um/min, which creates a significantly wider operating window. The tunable nature of the Ag composition in this formulation makes it suitable for a number of applications and eliminates...

Latest Activity