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Tags:low silver

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This 2009 paper summaries results from iNEMI's work to evaluate low silver solder alloys, addressing questions over thermal fatigue data. The inconsistency of thermal fatigue data for low silver alloys to some extent reflects the high number of possible ...
Category:Reliability
Low silver lead-free solders are second-generation technologies that are being increasingly implemented globally for electronics assembly. They have better shock resistance in BGA's used for portable products and lower cost, particularly in wave and hand ...
Category:General
NetworkSolders
OwnerDom
Wayne Lam, ITRI. ITRI presents previously unpublished work on new low-cost lead-free solders starting to be used widely in China. Solder technology expert Wayne Lam from tin industry association ITRI presents previously unpublished work on new low-cos ...
Category:Solders
This paper from Werner Engelmeir was presented at the IPC APEX event in 2009. It presents and synthesises results from a number of publishe thermal cycling studies comparing SAC 3/405, SAC105 and SnAg lead-free solder alloys with SnPb solders. Although ...
Category:Reliability
This work investigates the effect of Fe addition on the microstructural, mechanical, and thermal properties of the Sn-1Ag-0.5Cu (SAC105) solder alloy. The addition of Fe leads to the formation of large circular FeSn 2 intermetallic compound (IMC) particle ...
Category:Archive
NetworkSolders
OwnerDom
In an effort to reduce the cost of solder, a second generation of lead free solders are being introduced with lower silver contents. As the silver contnt of SAC305 represents around 50% of the alloy cost, what effect does reducing the amount of silver to ...
Category:Solders
NetworkSolders
OwnerDom
This paper from Siemens was published at SMTA International in 2009 and released online by IPC Outlook.  It compares a wide range of data for SAC3/405 lead-free solder alloys with new low-silver alternatives including SAC105 and nickel/germanium con ...
Category:Reliability
This review and discussion paper was presented at SMTA International in 2009 by Indium Corporation. It reviews the history of lead-free solder alloy development noting particularly the advent of low silver solders. This was seen in the use of SN100C SnCu ...
Category:Solders
The lack of reliability characterization of new materials introduces uncertainty for the user. To address this problem, the IPC Solder Products Value Council (IPC SPVC), in cooperation with several leading OEMs and EMS companies, has published this free ...
Category:Reliability
This video interview by consultant Jasbir Bath describes the cost driver for adoption of low silver solders and its consequent technology challenges. Bath highlights the fact that low-silver solders have a 10'C higher SMT processing temperature that will ...
Category:Solders
This paper, presented on behalf of iNEMI at the 2009 IPC APEX event summarises efforts of US industry consortia to harmonise evaluation tests for the large number of lead-free solder alloys. This addresses a significant issue with comparing test results g ...
Category:Solders
Results from the NASA-DoD project looking at reliability of lead-free solders compared to conventional tin-lead. These were published in 2010 at the SMTA International conference. In the tests SN100C and SAC3/405 alloys were tested with a wide range of c ...
Category:Reliability
This paper shows the effects of adding small amounts of Ce on melting temperature, microstructure, wettability and mechanical properties of low Ag content Sn solder (Sn–1.0 wt.%Ag). It is found the addition of Ce had little influence on the melting behav ...
Category:Archive
This paper investigates the effect of adding Bi and Ni elements on the wettability, melting temperature and electromigration properties of SAC0705 (Sn-0.7Ag-0.5Cu) soldering on Cu pad. Results indicate that addition of some Bi and Ni elements into SAC070 ...
Category:Archive
This work investigates the effect of Fe addition on the microstructural, mechanical, and thermal properties of the Sn-1Ag-0.5Cu (SAC105) solder alloy. The addition of Fe leads to the formation of large circular FeSn 2 intermetallic compound (IMC) particle ...
Category:Archive
NetworkSolders
OwnerDom
This 2009 conference paper discusses in detail the shortcomings of current LF alloys, namely SAC305, the desired properties, and how closely new alloys meet these properties. Attempts will be made to predict which new alloys have the best chance to become ...
Category:Solders
The present study reviews the reliability of different SAC solder joints in term of both thermal cycling and drop impact from the viewpoints of bulk alloy microstructure and tensile properties. It found out that the best SAC composition for drop impact pe ...
Category:Archive
A US consortium working together on the use of low silver lead-free solders for BGA Coordinator:  Greg Henshall, Hewlett-Packard Years: 2008- Funding: Industry in-kind Participants:Quyen Chu, Anthony Babasa, Evan Doxtad, Michael Lapitan,  ...
Category:Components
The strength of new lead-free solder alloys Sn-1.0Ag-0.5Cu containing 0.05-0.1 wt.% boron were investigated under a range of isothermal aging and reflow conditions. The boron-doped solder joints showed higher ball pull strength than the baseline Sn-1.0Ag ...
Category:Archive