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With the phasing out of lead in electronics, tin whisker mitigation has come to the forefront as one of the biggest reliability challenges in the electronics industry. Researchers are attempting to understand the causes of tin whisker growth, and methods ...
Category:Archive
OwnerDom
Driven by European Union directives, most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment in 2006. As a result of a global movement away from using lead (Pb), component manufacturers are inc ...
Category:Archive
The banning of Pb in electronic component termination finishes has had a marked effect on the supply chain, making it difficult for high reliability users to purchase Pb containing interconnects. It has also led to increasing concern over tin whiskers. M ...
Category:Archive
Sn whiskers are seen as a serious reliability problem in microelectronics where Pb-free solder technology is being implemented with pure Sn or Sn-rich alloys. Numerous investigations have been performed to understand the whisker growth mechanisms in an ef ...
Category:Directory
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF) solders, tin and its alloys have come to the forefront as the first choice of replacement to tin-lead. On the solder side the transit ...
Category:Archive
Studies have shown that Sn solder alloys such as SAC deposits can be whisker prone, and that even SnPb solders may produce whiskers. Tests were conducted on specimens of 2400 A SAC305 (Sn∼3.0%Ag-0.5%Cu), along with 750 and 1200Å Sn-37Pb films, each sputte ...
Category:Archive
OwnerDom
Since the implementation of environmental regulations in 2006, the electronic industry has moved to Pb-free solders. Harsh environment industries that were exempted from the regulations will soon have to follow suit. However, a suitable replacement solder ...
Category:Archive
A new method was developed to prepare intact tin whiskers as transmission electron microscope specimens, allowing in situ observation of tin whisker growth from RESn3 (RE = Nd, La, Ce) film specimens. Electron irradiation was discovered to effect the gro ...
Category:Archive
This paper studies the effect of corrosion due to flux type and the stress that creates as a potential driver for whisker growth.
Category:Archive
NetworkSolders
OwnerDom
Whisker growth on the surface of tin-rich, lead-free alloys soldered on a Cu layer depends on the laminate used for the printed circuit board. The difference in the thermal expansion coefficients of the resin and the glass fibre causes local compressive s ...
Category:Reliability
Tin whiskers have been thought to be a risk resulting in electronic circuit shorts. This study presents a novel energy photo flashing approach (photosintering) to shorten and eliminate Sn whiskers. Photosintering has been shown to be very effective in mod ...
Category:Archive
This paper by Nihon Superior was presented at the SMTA Pan Pacific Symposium 2010. Corrosion has been identified as one source of the compressive stress that is a driver of whisker growth in high tin lead-free solders and in this paper the authors report ...
Category:Reliability
Tin oxide nano particles dispersed in water solution were sprayed on the tin-plated copper surface and served as coating layer in order to study its effect on the prevention of tin whisker formation. The results indicated that tin oxide nano particles co ...
Category:Archive
Adding trace amount of rare-earth (RE) in the solder can significantly improve the of solder alloy properties. However, RE-phases with large size precipitated in the Sn-3.8Ag-0.7Cu-1.0 RE solder alloy will be oxidized when exposed in air, and tin whiskers ...
Category:Archive
The most serious of effects of solderable pure tin deposits is the growth of whiskers during heat/humidity (55oC/85% r.h.) storage. Another deficiency of equal concern is the deterioration of solderability after long term storage or after steam ageing. By ...
Category:Archive
Large sized CeSn3 and ErSn3 phases precipitated in the Sn-3.8Ag-0.7Cu-1.0Ce/Er solder alloy will be oxidized when they are exposed in air. Rapid tin whiskers growth has been found on the surface of the oxidized CeSn3 and ErSn3 phase. The growth behavior ...
Category:Archive
Recent research has found that Pb-free solder alloys doped with trace amounts of rare earth (RE) elements show a very strong propensity to grow Sn whiskers. In this work, the effect of adding 2 wt.% Ce, La or Y on the whiskering behavior of Sn-3.9Ag-0.7C ...
Category:Archive
It is reported that adding rear earth (RE) additives could induce whiskers growth in Sn-0.7Cu-Nd solder. With addition of 0.5wt% Nd, Sn3Nd was formed. After exposure to ambient conditions, the solders have a strong tendency toward whisker growth, with a ...
Category:Archive
To evaluate tin-whisker growth during thermal cycling tests, a simulation technique for calculating the change in atomic-density distribution of tin caused by a change in temperature, which induces a stress gradient in polycrystalline tin plating, was dev ...
Category:Archive
Raytheon participated with an industry working group to evaluate the ability of different types of conformal coatings to mitigate tin whisker growth. Bright Sn-plated brass substrate coupons were selected due to their propensity to grow whiskers during on ...
Category:Archive