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International Tin Chemical and Solder Conference and Exhibition 2015

International Tin Chemical and Solder Conference and Exhibition 2015

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International Tin Chemical and Solder Conference and Exhibition 2015
Event Information
Category:
Location:
Hotel Istana, Kuala Lumpur, Malaysia
Time:
From : Wednesday, 07 October 2015 09:00 AM
Until : Thursday, 08 October 2015 05:00 PM
(UTC 00:00) Western Europe Time, London, Lisbon, Casablanca, Reykjavik
Event Creator:

Event Details

International Tin Chemical and Solder Conference and Exhibition (ITCSCE) 2015

Hotel Istana, Kuala Lumpur, Malaysia.

7 & 8 October 2015

The aim of this Conference and Exhibition is to acquaint delegates with the mature markets relating to tin chemicals and solders as well as with the latest developments in applied work that portend new applica-tions. Market sustainability and measures to incentivise and stimulate downstream ventures on tin, includ-ing synergistic supply-chain arrangements, will also be covered in discussions relevant to business forums that will see the participation of some of the leading overseas manufacturers of tin chemicals and solders, local and regional tin stake-holders and other entrepreneurial groups.
The Conference and Exhibition is expected to:

Highlight the virtues of tin chemicals, solders and their roles in green technology and sustainable development,

Create a platform for researchers in the industry, academia and other research institutions to present their findings relating to research on tin chemicals and solders.

Allow manufacturers, businessmen, entrepreneurs, investors. technocrats and other government officials to gain a better insight into business opportunities in the tin chemicals and solder sectors, and

Provide an opportunity for intellectual discourse and business matching on the way forward for the tin chemical industry.

Topics
Papers on (but not limited to) the following topics are encouraged:

Developments in the tin chemical and solder industries,
including supply and demand

Research and development in applications of tin chemicals and solders

Tin in the development of green technology

Business and regulatory issues relating to tin chemicals and solders

Paper Presentation and Abstracts
Those interested to present should complete and submit the Registration Form for Paper Presenter via email to mcom@mcom.com.my before 30 June 2015.


All abstracts are to be written in English based on a 20 minutes paper presentation in accordance to the following guidelines:

The abstract should not be more than 200 words

Text must be in Times New Roman Font 12, single-spaced

Do not use all caps, bold prints or special fonts,

Do not include tables, photos or diagram,

Do not indent the paragraphs, and

Leave one space between paragraphs.

The abstract should be submitted in the format provided.

The abstract can be submitted separately, but in any case not later than 30 June 2015.


Arrangement is being made to have selected papers published in a reputable journal or other publications of good standing. The papers will have to be of a standard acceptable by the journal. A Technical Committee will be set up for peer review and evaluation of the suitability of the paper for publication. Presenters can also opt not to have their papers published.


Paper presenters shall be exempted from paying the Conference Participant Fee.
(Limited to one exemption per paper

"The Conference and Exhibition aim to raise awareness on the resilience and promise of tin as a key industrial material with a bright future and the huge impact it will continue to have on green technology, sustainability and global consumer economics".

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