Technology // Soldertec

Soldertec

High soldering temperatures the main threat to PCB reliability

Post By: Andy Pye on Wednesday, 09 May 2012

In his workshop on Building Long-Term Reliability in PCBs: Materials, Plating Processes and Innerlayer Treatments for Lead-Free Assembly Requirements, which took place at IPC APEX EXPO on 26 February, Mike Carano of OMG Electrochemicals highlighted that the principal threat to the reliability of printed circuit boards (PCBs) comes from one source - the temperatures required during the soldering processes for the assembly of the components onto the PCB.

These reliability issues can be mitigated if fabricators understand the...

New nanocomposite solder technology improves service reliability

Post By: Andy Pye on Wednesday, 09 May 2012

Although it has been demonstrated that composite solders can improve service performance in these conditions, there are no systematic solutions regarding the types of solder additives that can best achieve the desired performance. A new paper from Michigan University, US reviews the field and demonstrates a new type of nanotechnology based on a hybrid silica material.

The service performance of lead-free solder interconnects in modern microelectronics require improvements in thermomechanical fatigue (TMF) and solder reliability, especially in situations that...

[1] 2 3 4 5 6 7 8 9 10 > >>

Latest Activity

Richard Burrow joined the group Tinplate Detinning

15 days ago
Richard Burrow Joined the network "Tinplate"

72 days ago
Richard Burrow Joined the network "Alloys & Coatings"

72 days ago
Richard Burrow Joined the network "Tinplate"

81 days ago

Total Members: 79 View all members

Do you know where I might be able to find fatigue curves for pure tin?

Posted on 17th May 2012 by Tony Wallace
How can I get a sample of Indalloy 19?

I need a low temperature solder to make up an electrochemical cell. I heard a...

Posted on 3rd May 2012 by Jeremy Pearce
Does anyone know a good review paper on tin pest

Thanks for any help.

Posted on 11th Apr 2012 by Tony Wallace

Soldertec Group 30 members 1 discussion

Show all

Network Leader

Dr Jeremy Pearce View Profile

Soldertec coordinates a global network of solder manufacturers, electronics supply chain companies and research organisations. The network is focused on advanced soldering technologies and aims to provide opportunities for members to identify and develop new technologies and address key industry issues, including working group forums.

Electronics Goes Green 2012+

Starts: 09/09/2012

Ends: 12/09/2012

Event website Call for Papers Abstracts should cover at least one of the following topics: Legislative Developm...

View Event

International Printed Circuit & Electronics Assembly Fair (HKPCA & IPC Show)

Starts: 28/11/2012

Ends: 30/11/2012

View Event

Explorative study into the sustainable use and substitution of soldering metals in electronics

This work uses a top-down approach as research framework to study the sustainable u...

Posted on 18th May 2012 by Yun Wei
BAE probabilistic assessment of component lead-to-lead tin whisker bridging 2009

In the present work, a probabilistic model based on measured whisker observations i...

Posted on 18th May 2012 by Yun Wei
Comparing lead-free and eutectic solder interconnects on a BGA package for ICT applications

This presentation describes the importance of impact testing, life tests and types ...

Posted on 18th May 2012 by Bhairav Patel
DfR maximum tin whisker lengths 2008

In this 2008 white paper, DfR modified its guidance on tin whisker mitigation.

DfR...

Posted on 18th May 2012 by Yun Wei
Flase whiskers: masquerading tin copper intermetallics

This paper describes the misidentification of tin/copper intermetallic structures a...

Posted on 18th May 2012 by Yun Wei

top

Head Office
Unit 3, Curo Park
Frogmore, St. Albans
Hertfordshire AL2 2DD
Telephone: +44 (0) 1727 875 544
Fax: +44 (0) 1727 871 341
Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

China Office
Room 1003, 10F, Canway Building
No.66 Nan Li Shi Lu, Xi Cheng District
Beijing 100045
Tel: +86-10-68080915
Fax: +86-10-68080975

Company Registration No. 2994115 (England and Wales)
VAT Registration No. GB 852475216

Web development by Organic Development

Feedback

I Need Help!

Technology // Soldertec

Soldertec

High soldering temperatures the main threat to PCB reliability

New nanocomposite solder technology improves service reliability

Highlights

Recent Network Members

Questions

Do you know where I might be able to find fatigue curves for pure tin?

How can I get a sample of Indalloy 19?

Does anyone know a good review paper on tin pest

Network Groups

Network Leader

Nework Events

Electronics Goes Green 2012+

International Printed Circuit & Electronics Assembly Fair (HKPCA & IPC Show)

Information

Explorative study into the sustainable use and substitution of soldering metals in electronics

BAE probabilistic assessment of component lead-to-lead tin whisker bridging 2009

Comparing lead-free and eutectic solder interconnects on a BGA package for ICT applications

DfR maximum tin whisker lengths 2008

Flase whiskers: masquerading tin copper intermetallics

Contact Info

Support