Technology // Soldertec

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High soldering temperatures the main threat to PCB reliability

Post By: Andy Pye on Wednesday, 09 May 2012

In his workshop on Building Long-Term Reliability in PCBs: Materials, Plating Processes and Innerlayer Treatments for Lead-Free Assembly Requirements, which took place at IPC APEX EXPO on 26 February, Mike Carano of OMG Electrochemicals highlighted that the principal threat to the reliability of printed circuit boards (PCBs) comes from one source - the temperatures required during the soldering processes for the assembly of the components onto the PCB.

These reliability issues can be mitigated if fabricators understand the...

New nanocomposite solder technology improves service reliability

Post By: Andy Pye on Wednesday, 09 May 2012

Although it has been demonstrated that composite solders can improve service performance in these conditions, there are no systematic solutions regarding the types of solder additives that can best achieve the desired performance. A new paper from Michigan University, US reviews the field and demonstrates a new type of nanotechnology based on a hybrid silica material.

The service performance of lead-free solder interconnects in modern microelectronics require improvements in thermomechanical fatigue (TMF) and solder reliability, especially in situations that...

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Do you know where I might be able to find fatigue curves for pure tin?

Posted on 17th May 2012 by Tony Wallace
How can I get a sample of Indalloy 19?

I need a low temperature solder to make up an electrochemical cell. I heard a...

Posted on 3rd May 2012 by Jeremy Pearce
Does anyone know a good review paper on tin pest

Thanks for any help.

Posted on 11th Apr 2012 by Tony Wallace

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Soldertec coordinates a global network of solder manufacturers, electronics supply chain companies and research organisations. The network is focused on advanced soldering technologies and aims to provide opportunities for members to identify and develop new technologies and address key industry issues, including working group forums.

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Soldering Surface Mount Devices a Photographic Guide 1988

This booklet is designed to give photographic guidance to quality control inspector...

Posted on 25th May 2012 by Yun Wei
Surface tension of some Sn-Pb alloys: Part 1. Effect of Bi, Sb, P, Ag and Cu on 60Sn-40Pb solder

The maximum bubble pressure method has been used to measure the surface tension of ...

Posted on 25th May 2012 by Yun Wei
Metallurgy of Soldered Joints in Electronics 1990

This booklet provides a metallographic guide to the metallurgy and processing aspec...

Posted on 25th May 2012 by Yun Wei
Solder joint defects in surface mount technology

An overview is presented of the methodology needed to solve successfully the surfac...

Posted on 25th May 2012 by Yun Wei
The assessment of the solderability of surface-mounted devices using the wetting balance

The validity of using a wetting balance for assessing the solderability of surface-...

Posted on 25th May 2012 by Yun Wei

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Technology // Soldertec

Soldertec

High soldering temperatures the main threat to PCB reliability

New nanocomposite solder technology improves service reliability

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Do you know where I might be able to find fatigue curves for pure tin?

How can I get a sample of Indalloy 19?

Does anyone know a good review paper on tin pest

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Electronics Goes Green 2012+

International Printed Circuit & Electronics Assembly Fair (HKPCA & IPC Show)

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Soldering Surface Mount Devices a Photographic Guide 1988

Surface tension of some Sn-Pb alloys: Part 1. Effect of Bi, Sb, P, Ag and Cu on 60Sn-40Pb solder

Metallurgy of Soldered Joints in Electronics 1990

Solder joint defects in surface mount technology

The assessment of the solderability of surface-mounted devices using the wetting balance

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