Add your information hereArchive
Archive 
Recently Added Information
This conference paper describes a new flip chip technology. This method is adapted to fine pitch and large devices.
Gold appears as a good choice of material for micro-tips performing, because an intermetallic phase is formed with solder materials and en ...
OwnerYun Wei
This conference paper focuses on new results in the field of failure detection and residual stress measurements on micro-and nano-structures of electronic packages along with different modelling approaches like Finite Element and force field methods.
Bas ...
OwnerYun Wei
The 0.2Co + 0.1Ni dual additives were used to dope a Sn-3.5Ag solder matrix to modify the alloy microstructure and the solder joint on an organic solderability preservative (OSP) Cu pad. The intermetallic compounds formed are characterized.
OwnerYun Wei
Composite solders up to 1 wt.% reinforcement of SWCNTs in 63Sn-37Pb solder were prepared and the mechanical, structure and melting properties characterized.
OwnerYun Wei
In this study, finite FEA modeling of solder joint (Sn-3.8Ag-0.7Cu Pb-free solder joints with Cu-OSP and ENIG surface finish) reliability has been developed to model the effect of intermetallic compound (IMC) layer on solder joint fatigue behavior.
Nano- ...
OwnerYun Wei
This article is a review of the 2007 IEEE 11th international symposium and exhibition on advanced packaging materials processes, properties and interfaces.
The proceedings contain 68 papers.
OwnerYun Wei
This paper discussed the application of nanotechnology to electronics interconnect industry.
There are a large number of potential routes to new computing, storage and optical devices. Nanowires and other structures using atomic cluster deposition show p ...
OwnerYun Wei
Based on the developed analytical stress model, it is demonstrated that the employment of highly compliant materials and structures as bonding layers in bi-material assemblies (joints) can lead to a significant stress relief.
The model indicates that in ...
OwnerYun Wei
This 2006 proceedings contains 222 papers. The topics include:
• new nano-thermal interface material for heat removal in electronics packaging;
• nanoparticles of lead free solder alloys;
• ultra fine solder powder related to waferbumping with the ultr ...
OwnerYun Wei
An electrochemical sensing technique, based on nanocapillaries, is used to track corrosion initiation processes at reinforcing particles on lead-free solder alloys as well as to evaluate the corrosion behavior of single phases on WC-Co hardmetals.
The re ...
OwnerYun Wei