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Ourdjini, A.; Hanim, M.A.A.; Koh, S.F.J.; Siti Aisha, I.; Tan, K.S.; Chin, Y.T.;Univ. of Technol. Malaysia (UTM), Johor BahruProc. Electronics Manufacturing and Technology, 31st International Conference, Petaling Jaya, Malaysia, 8-10 Nov. 2007, ...
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Zhiheng Huang, Paul P. Conway, Erik Jung, Rachel C. Thomson, Changqing Liu, Thomas Loeher and Mathias MinkusJournal of Electronic Materials (2006), 35, No.9, p1761-1772
This paper studies size effects in lead-free solder joints by examining and mod ...
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Yu, C.a b , Yang, Y.a , Wang, K.a , Xu, J.a b , Chen, J.a b , Lu, H.a ba School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, 200240, Chinab Shanghai Key Laboratory of Materials Laser Processing and Modification, Shanghai, ...
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Qi, X.a b , Zhou, B.b , En, Y.ba School of Electronic and Information Engineering, South China University of Technology, Guangzhou, Chinab Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic P ...
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Kim, Y.a , Choi, H.a , Lee, H.a , Shin, D.a , Moon, J.b , Choe, H.aa School of Advanced Materials Engineering, Kookmin University, Jeongneung-dong, Seongbuk-gu, Seoul 136-702, South Koreab MK Electron Co., Ltd, 316-2 Geumeoh-ri, Pogok-eup, Cheoin-gu, Yong ...
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Yoon, J.-W., Noh, B.-I., Choi, J.-H., Jung, S.-B.School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, South KoreaJournal of Materials Science: Materials in Electronics, ...
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Kang, T.Y.a , Xiu, Y.Y.b , Hui, L.b , Wang, J.J.b , Tong, W.P.a , Liu, C.Z.ba Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110004, Chinab Shenyang Aerospace University, Shenyang 110136 ...
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Soga, Tasao; Fujisawa, JapanShimokawa, Hanae; Yokohama, JapanNakatsuka, Tetsuya; Yokohama, JapanMiura, Kazuma; Yokohama, JapanNegishi, Mikio; Komoro, JapanNakajima, Hirokazu; Saku, JapanEndoh, Tsuneo; Komoro, Japan
US Pat 8022551, 20th Sep 2011Assigned t ...
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Ota, Ryo; Hitachi, JapanItabashi, Takeyuki; Hitachi, JapanUS Pat 8020745, 20th Sep 2011
Anti-oxide surface coating for solder balls for use in chipscale packaing, for example.
Uses sorbitan fatty acid ester, vitamin or vitamin derivative containing cycl ...
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Pang, Mengzhi; Phoenix, AZ, United States of AmericaGurumurthy, Charan; Higley, AZ, United States of AmericaUS Pat 20100155115A1, 24th June 2010Assigned to Intel
Methods of forming a microelectronic structure are describe. Lead-free solder material is do ...
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